Novel MEMS Microphone Packaging Technology for an Inner Ear Microphone
The goal of this project is to deliver the last missing part of a packaging technology developed to realize a long term implantable microphone for a totally implantable cochlear implant (TICI). This titanium part is called the sound receptor (SR) and integrates submicron thick Ti diaphragms, which transfer sound energy from fluid inside the inner ear to the commercially available MEMS condenser microphone, which is protected by the packaging structure and located within the middle ear cavity.
Medical devices technology (instrumentation, medical imaging, radiology)
Other therapeutic (including defibrillators)