MENU
Aim higher

RELIEVE

RELIEVing chronic headachE with a soft encapsulated bioelectronic implant

We provide an innovative miniaturized neurostimulating implant to relieve patients from chronic headaches without the severe side effects that are common to pharmaceuticals. By combining innovative high-performance barrier layers with soft encapsulation technology, the RELIEVE bioelectronic system will be flexible so that it conforms to the patient’s anatomy and small enough so that it can be placed during a short outpatient needle-like intervention.
Acronym: 
RELIEVE
Project ID: 
12 560
Ranking: 
7
Cut-off: 
9
Start date: 
01-10-2018
Project Duration: 
33months
Project costs: 
2 090 000.00€
Technological Area: 
Neurology, Brain Research
Market Area: 
Drug delivery and other equipment (including kidney dialysis machines)