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SECHIS

SERDES Chip for Space Applications

The main goal of the SECHIS project is to investigate the architectures for high speed serial interfaces using European microelectronics technologies and the implementation of a radiation hardened SERDES chip for use in space environment. The main project result will be a SERDES (Serializer/Deserializer) chip with a throughput over 2Gbps, implemented on IHP’s cutting edge technologies and ready for qualification.
Project ID: 
11 270
Ranking: 
62
Cut-off: 
7
Start date: 
01-12-2017
Project Duration: 
30months
Project costs: 
1 318 570.00€
Technological Area: 
Printed circuits and integrated circuits
Market Area: 
Standard semiconductors