Laser-assisted low-stress Reflow Bonding of optoelectronic Components
We want to investigate a laser assisted reflow bonding process for photonic components aiming for increased accuracy and component density for smaller package sizes to address novel products and new markets. This will be enabled by transmission laser soldering with absorption of laser radiation localized to the bond zone. We will generate process knowledge for automated bonding and an integrated process chain from component to package for economic, high throughput, and high yield manufacturing.
Jointing (soldering, welding, sticking)
Other manufacturing (not elsewhere classified)